Fudan University × Zhixin × Common-Mode Project Wins Second Prize in the 2025 “Shanghai Industry-Academia-Research Collaboration Excellence Award”

On December 26, the award ceremony for the 2025 “Shanghai Industry-Academia-Research Cooperation Excellence Project Award” (referred to as the “Shanghai Industry-Academia-Research Award”) was held at the Shanghai Municipal Committee of the Chinese People's Political Consultative Conference. The project “Research and Development of Key Chips for Anti-Interference Power Line Carrier Communication and Their Industrialization,” jointly submitted by Fudan University, Beijing Zhixin Microelectronics Technology Co., Ltd., and Common Mode Semiconductor Technology (Shanghai) Co., Ltd., was honored with the second prize. Led by Professor Yan Na's team at Fudan University, this project signifies the university's high recognition in industry-education integration and the commercialization of scientific achievements.

Award-winning Project: Research, Development, and Industrialization of Key Chips for Anti-Interference Power Line Carrier Communication

Power Line Carrier Communication (PLC) serves as the primary local communication method for electricity information collection within power systems. With the emergence of new services such as grid-connected photovoltaic power generation control and electric vehicle charging/battery swapping, higher demands have arisen for communication reliability, transmission rates, and service carrying capacity.

This project integrates Fudan University's cutting-edge R&D capabilities with the engineering and market resources of industry-leading enterprises to tackle technical challenges. It aims to develop PLC chip and system design technologies enabling long-distance, low-power communication, overcoming technical hurdles such as high electromagnetic compatibility complexity, challenging power supply environments, and rapidly changing channel characteristics in PLC communication. It addresses specialized challenges in power line communication, such as interference resistance and attenuation mitigation, fostering a virtuous cycle from fundamental research to applied development that supports industrial advancement.

Research Achievements in Key Chips and Modules for Anti-Interference Power Line Carrier Communication

(Top left) Fully digital RF PLL chip with feedforward gain calibration

(Top right) Wireless image transmission and visual processing module

(Bottom) Dual-mode communication module prototype

This project addresses market demands by integrating Fudan University's accumulated expertise in RF communication chips and talent resources with Beijing Zhixin and Gongmo Semiconductor's engineering validation capabilities and market channels, achieving precise complementary utilization of university-industry strengths. The university-enterprise partnership established a joint research center to undertake national and provincial-level projects for technological breakthroughs. Leveraging this tangible industry-academia-research collaboration platform, Fudan University has launched seven innovative scientific projects. These initiatives provide core technological support for developing key technologies such as core phase-locked loop IP and multi-parameter integrated signal conditioning modules. Through the industrialization capabilities of partner enterprises, the research achieves demonstration applications and industrial promotion of these critical technologies.